M336 – Projection Scanner
M336 300mm Projection Scanner
The M336, in it’s 2nd Generation, is a high-throughput, fully automated projection scanner specifically designed for processing 200mm and 300mm advanced packaging applications. Utilizing Tamarack’s proven illumination system and broadband projection lens, the M336 delivers resolution below 3um with a large depth of focus.
The M336 combines the best of a traditional stepper and mask aligner by utilizing a high-resolution projection lens with a full-wafer mask, thus enabling high-throughput exposure of wafers without mask contamination and with full wafer exposure including plating ring. Non-contact imaging eliminates defects and yield issues due to mask-to-substrate contact or contamination.
Tamarack’s core projection scanning technology utilizes a diamond-shaped high-intensity homogenized beam that overlaps adjacent scans by 50%. Matching and stitching errors that are problematic in other systems are eliminated. Since the entire exposure takes place in one continuous step, the M336 surpasses the throughput performance of traditional scanners. This results in a reduced processing cost, which ultimately translates into a lower total cost of ownership. The full-substrate mask also allows for the imaging of non-repeated features and high-speed edge exposure, thus differentiating the M336 from competitive systems.
Key Features and Benefits of the M336 include:
- broadband 1:1 catadioptric projection lens provides resolution < 3µm and a large depth of focus for accurate imaging of both thin and ultra-thick resists
- ability to process wafers/substrates up to 300mm x 300mm
- high irradiance and excellent beam uniformity from a single UV arc lamp for accurate and economical imaging of a variety of photoresists while maintaining high throughput
- automated alignment to accuracy of less than 1um, utilizing through-the-lens and off-axis vision optics coupled with Cognex’s pattern recognition system
- ability to control resist sidewall angles by varying the numerical aperture (0.07-0.14) and focal position at the resist surface
- selectable filters for the broadband illumination source and projection lens allow matching of wavelength to the specific resist characteristics
- robotic wafer handling from dual FOUP load ports (quad optional)
- automatic 14”/9” mask handling from mask library with capacity for 15 masks
- large projection lens working distance prevents any contact with the wafer
- intuitive and flexible control system enables highly customized process automation
- SECS/GEMM
Tamarack’s staff of sales engineers is available to help you optimize the M336 system for your application. To discuss your application in strict confidentiality, please contact us.