Laser Processing Systems


Tamarack laser processing systems have been proven technology since 1988 for a wide range of applications from semiconductor packaging to medical device manufacturing to MEMS.

Excimer Laser Processing Systems

Excimer laser systems can be used to ablate, anneal, de-bond and expose. Excimer ablation is best described as photo-chemically initiated electron excitation leading to a sudden increase in pressure which results in an explosive removal of material into monomers and gases known as ablation.

Tamarack Excimer Laser Systems utilize a mask to determine the pattern to be produced for ablation and exposure. This method of processing permits the generation of many complex shapes with minimal thermal effects, and produces superior edge quality while providing the flexibility to change shapes simply by changing the mask.  Tamarack’s proprietary large beam projection technology provides uniform illumination of large areas and patterns for optimal throughput.

Tamarack’s Excimer Laser Processing Systems include:

Solid State Laser Processing Systems

Solid State laser systems can be used to micro-drill, cut, structure, anneal and de-bond. Recent advancements in solid state lasers, such as high power, high rep-rate UV pico-second lasers, have opened new markets in electronics manufacturing.

Tamarack Solid State Laser Systems are extremely precise, offering minimal debris, ‘cold’ ablation with no thermal side-effects, depth control in the order of 10nms and resolution down to 2um. These systems use a direct write (mask-less) method, which provides faster setup and easy integration to CAM systems. Throughput is dependent on the pattern density and pattern structure.

Tamarack Solid State Laser Systems include:

Please contact us to discuss a specific Excimer or Solid State laser system application; or for help selecting the best system to fit your requirements.